Offered by the world renowned Clemson University Center for Corporate Learning and facilitated by PhDs on PackagingSchool.com, the CMPM showcases the latest technologies accelerating the packaging field. The CMPM provides a structured approach to deliver thought leadership in the space of packaging development, material procurement, and organizational management.
Program Details
The CMPM is an online, interactive teaching series that guides organization leaders through a process of designing effective packaging systems. The teachings enable students to realize their creativity, actualize cost-savings for their company, and develop complete packaging systems. Throughout the business quarter, students complete ten online courses and a packaging development plan, which applies the teachings of the courses to a current work project. The lessons within each course are on-demand, which means students can log in and learn at the time that best suits their schedule.
The CMPM is a 12 week 100% online program covering 10 subjects:
- The Global Competitive Landscape
- Project Management Essentials
- Regulations and Corporate Sustainability
- Material Management I
- Material Management II
- Package Labeling and Finishing
- Packaging Development Workflow
- Capital Equipment and Manufacturing
- Logistics and Supply Chain Management
- Leveraging Human Factors in Packaging Design
Upcoming Class Information
August 2 – October 22, 2021
Application deadline: July 24, 2021
September 30 – December 19, 2021
Application deadline: September 11, 2021
December 6, 2021 – February, 25, 2022
Application deadline: November 20, 2021
Tuition:
$7000 – payment plans are available
Time:
The program takes between 60 and 72 hours to complete in full. Each week of the CMPM requires approximately five hours of screen time.
Requirements:
Admission is by application only.
Are you a business owner? If you are looking to put one of more employees through this program contact us at 864-412-5000 or info@packagingschool.com for special pricing.
Registration
Admission is by application only
Upcoming Sessions:
Aug. 2 – Oct. 22, 2021
(Application Deadline Jul. 24, 2021)
Sept. 30 – Dec. 19, 2021
(Application Deadline Sept. 11, 2021)
Dec. 6, 2021 – Feb. 25, 2022
(Application Deadline Nov. 20, 2021)